Envalior ForTii® TX1 PPA-GF30 FR(40) PA4T High Temperature Polyamide

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Envalior ForTii® TX1 PPA-GF30 FR(40) PA4T High Temperature Polyamide
Categories:	Polymer; Thermoplastic; Polyphthalamide (PPA); Polyphthalamide (PPA), 30% Glass Fiber Reinforced
Material Notes:	ForTii® is a high temperature polyamide for applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries. ForTii® TX1 has robust mechanical & JEDEC Level 2 performance, enabling SMT process without deformation and low risk on blistering. TX1 has stable processing behavior and is suitable for typical consumer electronics connector manufacturing such as I/O, FPC and WTB connectors. Features: Phosphorous free. 30% glass reinforced. Processing: Injection molding. Former DSM Engineering Plastics product line is now with Envalior.
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Physical Properties	Metric	English	Comments

Density	1.46 g/cc	0.0527 lb/in³	Dry; ISO 1183
Moisture Absorption	1.60 %	1.60 %	Dry; Sim. to ISO 62
Linear Mold Shrinkage, Flow	0.0035 cm/cm	0.0035 in/in	Dry; ISO 294-4
Linear Mold Shrinkage, Transverse	0.012 cm/cm	0.012 in/in	Dry; ISO 294-4

Mechanical Properties	Metric	English	Comments
Tensile Strength at Break	65.0 MPa @Temperature 160 °C	9430 psi @Temperature 320 °F	ISO 527-1/-2
	95.0 MPa @Temperature 120 °C	13800 psi @Temperature 248 °F	Dry; ISO 527-1/-2
	140 MPa @Temperature 23.0 °C	20300 psi @Temperature 73.4 °F	Cond; ISO 527-1/-2
	150 MPa @Temperature 23.0 °C	21800 psi @Temperature 73.4 °F	Dry; ISO 527-1/-2
Elongation at Break	1.9 % @Temperature 23.0 °C	1.9 % @Temperature 73.4 °F	Cond; ISO 527-1/-2
	2.0 % @Temperature 23.0 °C	2.0 % @Temperature 73.4 °F	Dry; ISO 527-1/-2
	2.5 % @Temperature 120 °C	2.5 % @Temperature 248 °F	Dry; ISO 527-1/-2
	3.6 % @Temperature 160 °C	3.6 % @Temperature 320 °F	ISO 527-1/-2
Tensile Modulus	5.00 GPa @Temperature 160 °C	725 ksi @Temperature 320 °F	ISO 527-1/-2
	8.00 GPa @Temperature 120 °C	1160 ksi @Temperature 248 °F	Dry; ISO 527-1/-2
	11.5 GPa @Temperature 23.0 °C	1670 ksi @Temperature 73.4 °F	Dry; ISO 527-1/-2
	12.0 GPa @Temperature 23.0 °C	1740 ksi @Temperature 73.4 °F	Cond; ISO 527-1/-2
Flexural Strength	220 MPa	31900 psi	Cond; ISO 178
	240 MPa	34800 psi	Dry; ISO 178
Flexural Modulus	11.0 GPa	1600 ksi	Dry; ISO 178
	11.5 GPa	1670 ksi	Cond; ISO 178
Charpy Impact Unnotched	4.70 J/cm² @Temperature 23.0 °C	22.4 ft-lb/in² @Temperature 73.4 °F	Dry; ISO 179/1eU
	4.70 J/cm² @Temperature 23.0 °C	22.4 ft-lb/in² @Temperature 73.4 °F	Cond; ISO 179/1eU
Charpy Impact, Notched	0.700 J/cm²	3.33 ft-lb/in²	Dry; ISO 179/1eA
	0.700 J/cm²	3.33 ft-lb/in²	Cond; ISO 179/1eA

Electrical Properties	Metric	English	Comments
Dielectric Constant	3.8 @Frequency 1e+9 Hz	3.8 @Frequency 1e+9 Hz	Dry; IEC 60250
	3.9 @Frequency 1e+6 Hz	3.9 @Frequency 1e+6 Hz	Dry; IEC 60250
	3.9 @Frequency 1e+6 Hz	3.9 @Frequency 1e+6 Hz	Cond; IEC 60250
	3.9 @Frequency 1e+9 Hz	3.9 @Frequency 1e+9 Hz	Cond; IEC 60250
	4.2 @Frequency 100 Hz	4.2 @Frequency 100 Hz	Dry; IEC 60250
	4.2 @Frequency 100 Hz	4.2 @Frequency 100 Hz	Cond; IEC 60250
Dielectric Strength	33.0 kV/mm	838 kV/in	Dry; IEC 60243-1
	33.0 kV/mm	838 kV/in	Cond; IEC 60243-1
Comparative Tracking Index	600 V	600 V	Dry; IEC 60112
	>= 800 V	>= 800 V	Above 600V; Sim. to IEC 60112

Thermal Properties	Metric	English	Comments
CTE, linear	35.0 µm/m-°C	19.4 µin/in-°F	ASTM D696
	65.0 µm/m-°C	36.1 µin/in-°F	Dry; ISO 11359-1/-2
CTE, linear, Parallel to Flow	20.0 µm/m-°C	11.1 µin/in-°F	Dry; ISO 11359-1/-2
	30.0 µm/m-°C	16.7 µin/in-°F	ASTM D696
Melting Point	325 °C	617 °F	10°C/min. Dry; ISO 11357-1/-3
Deflection Temperature at 1.8 MPa (264 psi)	305 °C	581 °F	Dry; ISO 75-1/-2
UL RTI, Electrical	130 °C @Thickness 0.750 mm	266 °F @Thickness 0.0295 in	UL746B
Flammability, UL94	V-0 @Thickness 1.50 mm	V-0 @Thickness 0.0591 in	Dry; IEC 60695-11-10
	V-0 @Thickness 3.00 mm	V-0 @Thickness 0.118 in	Dry; IEC 60695-11-10

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PDSM7935 / 291371

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