CORFIL® 5250-4 is a single component, non-metallic filled, syntactic material formulated for use in insert potting, edge filling and core filling of high temperature honeycomb sandwich structures. CORFIL 5250-4 is based on bismaleimide (BMI) chemistry and is available in six and twelve ounce easy-to-use cartridges. Features & Benefits : - Co-curable with BMI composite materials
- Use in metallic and non-metallic honeycomb
- Excellent compressive strength up to 475°F (246°C)
- Easily spreadable
Applications: CORFIL 5250-4 is commonly used for honeycomb core filling, insert potting and edge filling applications in BMI composite (CYCOM® 5250-4) honeycomb sandwich panel construction.Information provided by Cytec, subsequently acquired by Solvay. |