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Ensinger PEI

Celanese AT 195 Low Density Polyethylene (LDPE)  (discontinued **)
Categories: Polymer; Thermoplastic; Polyethylene (PE); Low Density (LDPE); Low Density Polyethylene (LDPE), Molded

Material Notes: AT 195 resin is suitable for use in hot melt adhesive and coating applications. It complies with Code of Federal Regulation 21 CFR Section 177.1520 subject to extraction limitations for specific end use applications. Additives:

Applications: Adhesives & Sealants

Information provided by Celanese Corporation.

Key Words: hot melt coating and adhesive applications
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Physical PropertiesMetricEnglishComments
Density 0.910 g/cc0.0329 lb/in³ASTM D1505; ASTM D1928 Proc C Mod
Melt Flow 2300 g/10 min
@Load 0.325 kg,
Temperature 125 °C
2300 g/10 min
@Load 0.716 lb,
Temperature 257 °F
Modified; ASTM D1238
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore A 9393ASTM D2240
Hardness, Shore D 4242ASTM D2240
Tensile Strength at Break 5.60 MPa812 psiType IV (50 mm/min); ASTM D638
Elongation at Break 65 %65 %Type IV (50 mm/min); ASTM D638
 
Thermal PropertiesMetricEnglishComments
Melting Point 95.0 °C203 °FDSC; ASTM D3417
 
Compliance PropertiesMetricEnglishComments
FDA YesYesSee notes for details.

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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Overview of materials for Medium Density Polyethylene (MDPE), Molded

PATEVB21 / 25977

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