| Designed or a broad range of "Low-Temp" resins General Description: DYNA-PURGE K is a low-temp, non-abrasive, non-chemical “engineered” thermoplastic purging compound, formulated to flow naturally through the barrel and hot runner system of the injection molding machine, as well as extrusion equipment. A non-melting but softening thermoplastic scrubs the screw and barrel, while the carrier matrix flushes away impurities. FEATURES & BENEFITS OF DYNA-PURGE K - Developed for color changes, resin changes, preventative machine maintenance, and before manual cleaning
- Excellent for purging through hot runner systems with a minimum clearance of .025 inch (.65 mm)
- Effective through a wide temperature range 290°F to 550° F (143°C to 287°C)
- Easy to use – no process adjustment necessary – use at the resident resin processing temperature and RPM speed
- Non-abrasive, non-melting but softening thermoplastic, which thoroughly loosens carbonized and degraded resin, allowing it to be flushed out of the system
- Safe, non-hazardous, with no chemicals – ingredients are FDA compliant
- Heat stable – recommended during shutdown and start-up
- Low “cost-per-purge” – only small quantity needed to be effective
- No mixing required – simply use “as is”
- Unlimited shelf life
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