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Chemically Resistant adhesives
Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide
Categories: Polymer; Adhesive; Thermoset; Polyimide, TS

Material Notes: Product Description: EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-attach and hybrid microelectronic packaging.

Advantages & Application Notes:

  • It is a lower viscosity version of EPO-TEK® P1011 for improved die-stamping or pin transfer process methods
  • Suggested applications in hybrid micro-electronics:
    • Resisting ceramic or metal SMD lid sealing processes >300°C.
    • Die attaching quartz crystal oscillators to the Au post of TO-cans or Au/ pads on ceramic PCBs.
    • Down-hole petrochemical circuits
    • Atomic clocks, microwave or millimeter wave circuits
    • Die-attaching LED and EEPROM chips inside alpha numeric displays, resisting glass lid-sealing processes >300°C.
  • A two-step cure is suggested for optimal adhesive properties.
  • Available in alternative viscosities

Information Provided by Epoxy Technology

Available Properties
  • Specific Gravity
  • Particle Size
  • Viscosity, 20 rpm
  • Hardness, Shore D
  • Tensile Modulus, Storage
  • Shear Strength, Die
  • Volume Resistivity
  • CTE, linear, Below Tg
  • CTE, linear, Above Tg
  • Thermal Conductivity
  • Maximum Service Temperature, Air, Continuous
  • Maximum Service Temperature, Air, Intermittent
  • Minimum Service Temperature, Air, Continuous
  • Minimum Service Temperature, Air, Intermittent
  • Glass Transition Temp, Tg, Ramp 40°C/Min to 300°C
  • Decomposition Temperature, Degradation Temperature
  • Dry Time
  • Cure Time, Pre-Bake, Minimum Bond Line
  • Cure Time, Post-Cure, Minimum Bond Line
  • Shelf Life
Property Data

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Chemically Resistant adhesives
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