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Master Bond adhesives
Park Aerospace Nelco® N8000 Cyanate Ester Epoxy Laminate and Prepreg
Categories: Polymer; Thermoset; Epoxy

Material Notes: The Nelco N8000 is a high-Tg cyanate ester laminate and prepreg system that provides superior performance and product integrity and is ideal for board designs with higher layer counts, finer lines and spaces and larger panel sizes.

Key Features and Benefits:

  • High thermal performance
  • Self adhesive bond to foam cores
  • Superior electrical properties
  • Typical Cyanate Ester processing
  • S-glass and Quartz options

Applications:

  • Fine-Line Multilayers
  • Backplanes
  • Surface-Mount Multilayers
  • BGA Multilayers
  • MCM-L's
  • Direct Chip Attach
  • Automotive
  • Underhood Automotive
  • Wireless Communcations
  • High Speed Computing
  • Radomes and Secondary Aerospace Structure

Information provided by Park Electrochemical Corp.

Vendors:
Available Properties
  • Density, 50% resin content
  • Water Absorption, IPC-TM-650.2.6.2.1
  • Modulus of Elasticity, ASTM D3039, X
  • Modulus of Elasticity, ASTM D3039, Y
  • Poissons Ratio, ASTM D3039, X
  • Poissons Ratio, ASTM D3039, Y
  • Peel Strength, IPC-TM-650.2.4.8.2a, 1 oz. Cu, at elevated temperature
  • Peel Strength, IPC-TM-650.2.4.8, 1 oz. Cu, after exposure to process solutions
  • Peel Strength, IPC-TM-650.2.4.8, 1 oz. Cu, after solder float
  • Volume Resistivity, IPC-TM-650.2.5.17.1, C - 96/35/90
  • Volume Resistivity, IPC-TM-650.2.5.17.1, E - 24/125
  • Surface Resistance, IPC-TM-650.2.5.17.1, C - 96/35/90
  • Surface Resistance, IPC-TM-650.2.5.17.1, E - 24/125
  • Dielectric Constant, IPC-TM-650.2.5.5.5, 50% Resin Content; Stripline
  • Dielectric Constant, 50% Resin Content; Split Post Cavity
  • Dielectric Constant, IPC-TM-650.2.5.5.5, 50% Resin Content; Stripline
  • Dielectric Constant, IPC-TM-650.2.5.5.9, 50% Resin Content; RF Impedance
  • Dielectric Strength, IPC-TM-650.2.5.6.2
  • Dielectric Breakdown, IPC-TM-650.2.5.6
  • Dissipation Factor, 50% Resin Content; Split Post Cavity
  • Dissipation Factor, IPC-TM-650.2.5.5.5, 50% Resin Content; Stripline
  • Dissipation Factor, IPC-TM-650.2.5.5.5, 50% Resin Content; Stripline
  • Arc Resistance, IPC-TM-650.2.5.1
  • CTE, linear, IPC-TM-650.2.4.41, X/Y
  • Glass Transition Temp, Tg, IPC-TM-650.2.4.24c, TMA
  • Glass Transition Temp, Tg, IPC-TM-650.2.4.25c, DSC
  • Glass Transition Temp, Tg, IPC-TM-650.2.4.24.3, DMA (Tan d Peak)
  • Decomposition Temperature, IPC-TM-650.2.4.24.6, TGA; 5% wt. loss
  
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Manufacturer Notes:
Park Aerospace, former Park Electrochemical Corp.

Category Notes
Plastic

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