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Rapid Manufacturing
DSM ForTii® Eco LDS62B PA*-GF35 PA4T High Temperature Polyamide
Categories: Polymer; Renewable/Recycled Polymer; Thermoplastic; Nylon (Polyamide PA)

Material Notes: ForTii® is a high temperature polyamide for applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries.

ForTii® Eco LDS62B is a high ductility LDS material which enables good structural integrity in complicated geometries. It is well suited for wearable devices and smart phone antennas for consumer electronics. It has excellent dimensional stability to ensure low warpage after chemical plating. Eco LDS62B is Eco-friendly due to its partly bio-based content. Features: Bio-based - 14C measurable. Laser Direct Structuring. Low warpage. 35% glass reinforced. Processing: Injection molding.

Information provided by DSM Engineering Materials

Vendors:
Available Properties
  • Density, ISO 1183, Dry
  • Linear Mold Shrinkage, Flow, ISO 294-4, Dry
  • Linear Mold Shrinkage, Transverse, ISO 294-4, Dry
  • Tensile Strength at Break, ISO 527-1/-2, Dry
  • Elongation at Break, ISO 527-1/-2, Dry
  • Tensile Modulus, ISO 527-1/-2, Dry
  • Flexural Strength, ISO 178, Dry
  • Flexural Modulus, ISO 178, Dry
  • Charpy Impact, Notched, ISO 179/1eA, Dry
  • Dielectric Constant, IEC 60250, Dry
  • Dielectric Constant, IEC 60250, Cond
  • CTE, linear, ISO 11359-1/-2, Dry
  • CTE, linear, Parallel to Flow, ISO 11359-1/-2, Dry
  • Melting Point, ISO 11357-1/-3, 10°C/min. Dry
  • Deflection Temperature at 1.8 MPa (264 psi), ISO 75-1/-2, Dry
  • Flammability, UL94, IEC 60695-11-10, Dry
  • Flammability, UL94, IEC 60695-11-10, Dry
  
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Manufacturer Notes:
DSM Engineering Plastics; DSMEP

Category Notes
Plastic
PA, Polyamide

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