DSM ForTii® Eco LDS62B PA*-GF35 PA4T High Temperature Polyamide

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DSM ForTii® Eco LDS62B PA*-GF35 PA4T High Temperature Polyamide
Categories:	Polymer; Renewable/Recycled Polymer; Thermoplastic; Nylon (Polyamide PA)
Material Notes:	ForTii® is a high temperature polyamide for applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries. ForTii® Eco LDS62B is a high ductility LDS material which enables good structural integrity in complicated geometries. It is well suited for wearable devices and smart phone antennas for consumer electronics. It has excellent dimensional stability to ensure low warpage after chemical plating. Eco LDS62B is Eco-friendly due to its partly bio-based content. Features: Bio-based - 14C measurable. Laser Direct Structuring. Low warpage. 35% glass reinforced. Processing: Injection molding. Information provided by DSM Engineering Materials
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Available Properties

Density, ISO 1183, Dry
Linear Mold Shrinkage, Flow, ISO 294-4, Dry
Linear Mold Shrinkage, Transverse, ISO 294-4, Dry
Tensile Strength at Break, ISO 527-1/-2, Dry
Elongation at Break, ISO 527-1/-2, Dry
Tensile Modulus, ISO 527-1/-2, Dry
Flexural Strength, ISO 178, Dry
Flexural Modulus, ISO 178, Dry
Charpy Impact, Notched, ISO 179/1eA, Dry
Dielectric Constant, IEC 60250, Dry
Dielectric Constant, IEC 60250, Cond
CTE, linear, ISO 11359-1/-2, Dry
CTE, linear, Parallel to Flow, ISO 11359-1/-2, Dry
Melting Point, ISO 11357-1/-3, 10°C/min. Dry
Deflection Temperature at 1.8 MPa (264 psi), ISO 75-1/-2, Dry
Flammability, UL94, IEC 60695-11-10, Dry
Flammability, UL94, IEC 60695-11-10, Dry

Property Data

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Manufacturer Notes:
DSM Engineering Plastics; DSMEP

Category Notes
Plastic
PA, Polyamide

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