Honeywell HT3500 Thermally Conductive Gap Fillers

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Honeywell HT3500 Thermally Conductive Gap Fillers
Categories:	Polymer; Thermoset; Silicone
Material Notes:	Benefits And Features: High thermal performance low contact resistance Easily dispensable and reworkable High compressibility for low stress applications Reliable thermal performance No pump out and cracking risk Overview: Honeywell HT one-part series Gap Filler provides an effective thermal properties and high conformability with its high compressibility. It is formulated to deliver high dispense rates for improved productivity, long-term reliability performance and easy reworkability. It is designed to minimize thermal resistance at interfaces, maintain excellent performance through reliability testing, and provide scalable application at a competitive cost. Typical Applications: Consumer electronics Telecommunications equipment Automotive electronics Power supplies & semiconductors Memory & power modules Power electronics Information provided by Honeywell
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Physical Properties	Original Value	Comments

Specific Gravity	3.40 g/cc	ASTM D792
Outgassing - Total Mass Loss	<= 0.50 %	ASTM E595

Thermal Properties	Original Value	Comments
Thermal Conductivity	3.50 W/m-K	ASTM D5470

Processing Properties	Original Value	Comments
Shelf Life	12.0 Month

Descriptive Properties
Color	Dark Red
Dispense Rate	>10 g/min	90 Psi, 30cc EFD syringe
Minimum BLT	0.10 mm

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PHONWL6002 / 255332

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