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Chemically Resistant adhesives

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Epoxy Technology EPO-TEK® 930 Thermally Conductive Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive

Material Notes: Material Description: A two-part thermally conductive epoxy for heat sinking electronics and hybrids. It can be used at the PCB level for circuit assembly.

Information Provided by Epoxy Technology

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.02 g/ccPart B
 1.66 g/ccPart A
Particle Size <= 500 µm
Viscosity >= 819200 cP
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 82
Tensile Modulus 1.314e+6 psiStorage
Shear Strength 658 psiLap
 >= 1700 psiDie
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 2.00e+13 ohm-cm
Dielectric Constant 3.96
@Frequency 1000 Hz
Dissipation Factor 0.0060
@Frequency 1000 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 16.0 µm/m-°CBelow Tg
 81.0 µm/m-°CAbove Tg
Thermal Conductivity 4.57 W/m-K
Maximum Service Temperature, Air 150 °CContinuous
 250 °CIntermittent
Minimum Service Temperature, Air -55.0 °CContinuous
 -55.0 °CIntermittent
Glass Transition Temp, Tg >= 90.0 °CDynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 350 °CDegradation Temperature
 
Processing PropertiesOriginal ValueComments
Cure Time 6.00 hour
@Temperature 80.0 °C
minimum
 10.0 min
@Temperature 150 °C
minimum
Pot Life 360 min
Shelf Life 12.0 Month
@Temperature 25.0 °C
 
Descriptive Properties
ColorAmberPart B
 WhitePart A
ConsistencyGranular paste
Mix Ratio by Weight100:3.3
Number of ComponentsTwo
Weight Loss0.86%300°C

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PPOXYT057 / 141096

Chemically Resistant adhesives

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