Aptek 6110-A/B Epoxy Encapsulant and/or Potting Compound

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Aptek 6110-A/B Epoxy Encapsulant and/or Potting Compound
Categories:	Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes:	Optoelectronic grade encapsulant/potting compound – will not attack/cloud polysulphone casings. More flexible, lower Tg version of APTEK 6106-A/B, for good temperature cycling in ceramic devices. Part A is pale yellow to pale blue. Part B is water clear. Information provided by Aptek Laboratories, Inc.
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Physical Properties	Original Value	Comments

Density	0.940 g/cc	B Component; ASTM D1475
	1.15 g/cc	A Component; ASTM D1475
Viscosity	65 cP	B Component; Spindle #2; speed 100 rpm; ASTM D1824
	3400 cP	A Component; Spindle #3; speed 10 rpm; ASTM D1824

Mechanical Properties	Original Value	Comments
Hardness, Shore D	85	Cured property; ASTM D2240

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 1.00e+15 ohm-cm	Cured property; ASTM D257

Thermal Properties	Original Value	Comments
Flash Point	>= 100 °C	B Component; ASTM D92
	>= 200 °C	A Component; ASTM D92

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PAPTEK41 / 24203

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