Henkel Loctite® ECCOBOND UV8800M-X Epoxy

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Henkel Loctite® ECCOBOND UV8800M-X Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Milky white Cure: Ultraviolet (UV) light Product Benefits: One component Fast UV cure Good workability Good adhesion Application: Encapsulant, Glob top Typical Package Application: Chip scale packages, Smart Card Substrates: FR4, FCI and LG Tape LOCTITE ECCOBOND UV8800M-X encapsulant is formulated for use in smart card applications. It cures to form a hard translucent coating when exposed to UV light of sufficient intensity. The curing of the product is not inhibited by oxygen, resulting in excellent surface cure. Information provided by Loctite®
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Mechanical Properties	Original Value	Comments

Hardness, Shore D	80	Cured
Tensile Modulus	63.0 MPa @Temperature 200 °C
	94.0 MPa @Temperature 100 °C
	4816 MPa @Temperature 25.0 °C

Thermal Properties	Original Value	Comments
CTE, linear	48.0 µm/m-°C	Cured, Below Tg
	149 µm/m-°C	Cured, Above Tg
Glass Transition Temp, Tg	47.0 °C	Cured, by TMA

Processing Properties	Original Value	Comments
Working Life	168 hour
Shelf Life	6.00 Month @Temperature 0.000 - 8.00 °C

Descriptive Properties
Extractable Ionic Content (ppm)	<10	Cured, Chloride (Cl-)
	<10	Cured, Sodium (Na+)
Shear Strength	>20 kg-f	Die, 4 x 4 mm Si die on glass @ 25°C
	5.8 kg-f	Die, 4 x 4 mm Si die on glass @ 200°C
Thixotropic Index	1.1	Uncured, 2/20 s-1

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PLOCT5109 / 255320

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