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Epoxyset Epoxibond EB-177 Unfilled Epoxy Adhesive
Categories:
Polymer
;
Adhesive
;
Thermoset
;
Epoxy
;
Epoxy Adhesive
Material Notes:
A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.
Information provided by Epoxyset Inc.
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Physical Properties
Original Value
Comments
Density
1.14
g/cc
Viscosity
200
-
500
cP
Mechanical Properties
Original Value
Comments
Hardness, Shore D
92
ASTM D2240
Adhesive Bond Strength
2000
psi
Lap Shear Strength
Thermal Properties
Original Value
Comments
CTE, linear
>=
50.0
µm/m-°C
Maximum Service Temperature, Air
200
°C
Minimum Service Temperature, Air
-55.0
°C
Glass Transition Temp, Tg
125
°C
Optical Properties
Original Value
Comments
Refractive Index
1.53
Processing Properties
Original Value
Comments
Cure Time
0.500
hour
@Temperature 150 °C
1.00
hour
@Temperature 125 °C
Pot Life
>=
300
min
Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's
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Epoxyset Epoxibond EB-119M Unfilled Epoxy Adhesive
PEPOXY805 / 150830
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