MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
  

Flame Retardant adhesives

Cookson Group Plaskon® SMT-B-2HS Molding Compound for Heat Spreader Applications  (discontinued **)
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes: This material is an epoxy molding compound for high temperature, lead-free reflow. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, multifunctional resin designed to pass JEDEC Level 3 at 220°C IR reflow temperatures.

Features:

  • Lower moisture pickup
  • Excellent moldability
  • High glass transition temperature
  • Fast cure

Information provided by Cookson Electronics
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Specific Gravity 1.88 g/cc1.88 g/cc
Moisture Absorption at Equilibrium 0.49 %0.49 %at 85°C/85% RH, 168 hours
Viscosity 4100 cP
@Temperature 175 °C		4100 cP
@Temperature 347 °F		Shimadzu Viscosity, 1000 psi
Spiral Flow 180 cm70.9 inat 175°C and 1000 psi
Ash 78.5 %78.5 %
Storage Temperature <= 5.00 °C<= 41.0 °FRecommended
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 7272Cull hot
Flexural Strength 68.646 MPa9956.3 psi
 7.8455 MPa
@Temperature 240 °C		1137.9 psi
@Temperature 464 °F
Flexural Modulus 14.71 GPa2134 ksi
 0.7257 GPa
@Temperature 240 °C		105.3 ksi
@Temperature 464 °F
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity  >= 1.00e+12 ohm-cm
@Temperature 150 °C		>= 1.00e+12 ohm-cm
@Temperature 302 °F
 >= 1.00e+15 ohm-cm
@Temperature 22.0 °C		>= 1.00e+15 ohm-cm
@Temperature 71.6 °F
Dielectric Constant 4.0
@Frequency 1000 Hz		4.0
@Frequency 1000 Hz
Dielectric Strength >= 15.7 kV/mm>= 400 kV/in
 
Thermal PropertiesMetricEnglishComments
CTE, linear  15.0 µm/m-°C
@Temperature 20.0 °C		8.33 µin/in-°F
@Temperature 68.0 °F		Alpha 1
 57.0 µm/m-°C
@Temperature 20.0 °C		31.7 µin/in-°F
@Temperature 68.0 °F		Alpha 2
Thermal Conductivity 0.700 W/m-K4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 190 °C374 °F
Flammability, UL94 V-0
@Thickness 3.17 mm		V-0
@Thickness 0.125 in
 
Processing PropertiesMetricEnglishComments
Mold Temperature 170 - 185 °C338 - 365 °F
Back Pressure 5.17 - 8.62 MPa750 - 1250 psi
Cure Time 1.17 - 2.00 min0.0194 - 0.0333 hourIn mold
 0.000 - 180 min
@Temperature 175 °C		0.000 - 3.00 hour
@Temperature 347 °F		Post mold
Gel Time 0.333 min0.333 minRam follower, at 175°C and 1000 psi
Shelf Life 0.100 Month0.100 Monthat 35°C, <40% loss of spiral flow
 0.250 Month0.250 Monthat 22°C, <40% loss of spiral flow
 24.0 Month24.0 Monthat 5°C, <40% loss of spiral flow
 
Descriptive Properties
Hydrolyzable Halides<1 ppm

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

Users of our Advanced Search (registration required) may exclude discontinued materials from search results.

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

Users viewing this material also viewed the following:
Cosmic Plastics E4930 Mineral & Glass Filled Epoxy Molding Compound, Encapsulated Grade
Cosmic Plastics E487 lass Filled Epoxy Molding Compound, Electrical Grade
Cosmic Plastics E486 lass Filled Epoxy Molding Compound, Electrical Grade
Cosmic Plastics E484 Glass Filled Epoxy Molding Compound, Electrical Grade
Cookson Group Plaskon® NXG-1HS Molding Compound for Heat Spreader Applications

PPLASK012 / 56302

Flame Retardant adhesives




Searches:   Advanced  •   Composition  •   Property  •   Material Type  •   Manufacturer  •   Trade Name  •   UNS Number
Other Links:   Advertising  •   Submit Data  •   Database Licensing  •   Web Design & Hosting  •   Trade Publications
Supplier List  •   Unit Converter  •   Reference  •   Links  •   Help  •   Contact Us  •   Site Map  •   FAQ  •   Home
 
Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at webmaster@matweb.com. We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2024 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.