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Chemically Resistant adhesives
Cookson Group Plaskon® SMT-B-1RC (146.403) Epoxy Molding Compound for PBGAs  (discontinued **)
Categories: Polymer; Thermoset; Epoxy; Epoxy Molding Compound

Material Notes: Test specimens were transfer molded and post cured 4 hours at 175°C.

An epoxy molding compound optimized specifically for PBGA applications. It has the same unique resin system as SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Faster cure speed for shorter cure times in multi-plunger and automolding equipment; Improved wire sweep performance (lower viscosity); Reduced post mold cure times; Improved warp performance

Vendors:
Available Properties
  • Density
  • Viscosity, Shimadzu Viscosity, 1000 psi
  • Spiral Flow, 175°C/1000 psi
  • Hardness, Shore D
  • Flexural Strength
  • Flexural Modulus
  • Electrical Resistivity
  • Dielectric Constant
  • Dielectric Strength
  • CTE, linear
  • CTE, linear, Transverse to Flow
  • Thermal Conductivity
  • Glass Transition Temp, Tg
  • Flammability, UL94
  • Flammability, UL94
  • Processing Temperature, Molding temperature
  
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Manufacturer Notes:
none

Category Notes
Plastic

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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Chemically Resistant adhesives
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