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Chemically Resistant adhesives
ITW Insulcast® INSULGEL 70 CC Epoxy Potting/Encapsulation Compound
Categories: Polymer; Thermoset; Epoxy
Material Notes: Insulcast® solutions are compounds designed for potting and encapsulating. NSULGEL 70 CC is an epoxy compound exhibiting low shrinkage and thermal shock resistance. By making use of an inherently flexible epoxy resin and special filler technology, INSULGEL 70 CC provides reduced shrinkage and low coefficient of thermal expansion. This results in decreased stress and improved adhesion to components. Several curing agents for INSULGEL 70 CC are offered to satisfy such diverse requirements as fast cure for small components, extended pot life for uses involving large mixed quantities, and a heat cure hardener for higher temperature requirements.

Information provided by ITW Performance Polymers.
Vendors:
Available Properties
  • Specific Gravity, Uncured. Insulcure 11B
  • Specific Gravity, Uncured. Part B-1
  • Specific Gravity, Uncured. Insulcure 9
  • Specific Gravity, Uncured. Insulgel 70 CC
  • Viscosity, ASTM D2393, Part B-1
  • Viscosity, ASTM D2393, Insulcure 9
  • Viscosity, ASTM D2393, Insulcure 11B
  • Viscosity, ASTM D2393, Insulgel 70 CC
  • Hardness, Shore D, ASTM D2240, Part B-1
  • Hardness, Shore D, ASTM D2240, Insulcure 9
  • Hardness, Shore D, ASTM D2240, Insulcure 11B
  • Tensile Strength, ASTM D638, cured. Insulcure 9
  • Tensile Strength, ASTM D638, cured. Part B-1
  • Tensile Strength, ASTM D638, cured. Insulcure 11B
  • Elongation at Break, ASTM D638, cured. Insulcure 11B
  • Elongation at Break, ASTM D638, cured. Insulcure 9
  • Elongation at Break, ASTM D638, cured. Part B-1
  • Volume Resistivity, ASTM D257, Part B-1
  • Volume Resistivity, ASTM D257, Insulcure 9
  • Volume Resistivity, ASTM D257, Part B-1
  • Volume Resistivity, ASTM D257, Insulcure 11B
  • Volume Resistivity, ASTM D257, Insulcure 9
  • Volume Resistivity, ASTM D257, Insulcure 11B
  • Dielectric Constant, ASTM D150, Part B-1
  • Dielectric Constant, ASTM D150, Insulcure 11B
  • Dielectric Constant, ASTM D150, Insulcure 9
  • Dielectric Strength, ASTM D149, Insulcure 9
  • Dielectric Strength, ASTM D149, Part B-1
  • Dielectric Strength, ASTM D149, Insulcure 11B
  • Dissipation Factor, ASTM D150, Part B-1
  • Dissipation Factor, ASTM D150, Insulcure 9
  • Dissipation Factor, ASTM D150, Insulcure 11B
  • CTE, linear, cured. Insulcure 9
  • CTE, linear, cured. Part B-1
  • CTE, linear, cured. Insulcure 11B
  • Thermal Conductivity, cured. Part B-1
  • Thermal Conductivity, cured. Insulcure 11B
  • Thermal Conductivity, cured. Insulcure 9
  • Maximum Service Temperature, Air, Part B-1
  • Maximum Service Temperature, Air, Insulcure 9
  • Maximum Service Temperature, Air, Insulcure 11B
  • Cure Time, Insulcure 11B, post cure 1 hr @ 150°C
  • Cure Time, Insulcure 9
  • Cure Time, Part B-1. Post cure 12 hrs @ 50°C
  • Pot Life, Insulcure 9. 100g
  • Pot Life, Insulcure 11B. 100g
  • Pot Life, Part B-1. 100 g
  • Shelf Life, Insulcure 11B
  • Shelf Life, Insulcure 9
  • Shelf Life, Insulgel 70 CC
  • Shelf Life, Part B-1
  
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Plastic

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Chemically Resistant adhesives



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