- Excellent surface wetting
- Eliminates the need for cleaning soldered boards
- May be conformal coated without post-solder cleaning
- Can be used with lead free solder
- Conforms to ANSI-J-STD-004, Type ORL0
Description: Superior No. 312 No-Clean flux is a specially formulated low-solids flux free of any halides, resin, or rosin. This flux was designed for soldering high quality electronic printed circuit boards (PCBs), such as, through-hole, mixed technology, and surface mount assemblies while eliminating the need for a post cleaning operation. Superior No. 312 No-Clean is formulated for foam or spray applications as supplied.Applications: WAVE SOLDERING-Superior No. 312 No-Clean, No-Clean Flux may be applied by foam, spray, or wave application. The optimum topside PCB preheat temperature recommendation is 93-115°C/200-240°F. Too low a preheat setting is indicated by post-solder residues on PCBs that look like water stains. A solder-bath temperature of 480°F ±20°F is recommended for optimum result. Information provided by Superior Flux |