Cookson Group Plaskon® MUF-2C Molded Underfill Compound for Flip Chip BGAs and CSPs

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Cookson Group Plaskon® MUF-2C Molded Underfill Compound for Flip Chip BGAs and CSPs (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is an epoxy Molded UnderFill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material’s higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON MUF Series is the total molded underfill solution for Flip Chip in Package. Features: Higher productivity Higher Tg Higher reliability Lower warpage Lower CTE Lower cost of ownership Minimum 220°C reflow Minimum JEDEC Level 3 Applications: PLASKON CMU-870-2C Molded Underfill is suitable for high volume underfill and overmold protection of Flip Chip BGA and CSP packages. It is suitable for stack die packages using a combination of wirebonded and flip chip dies wh
Vendors:

Available Properties

Specific Gravity
Viscosity, Shimadzu Viscosity, 1000 psi
Spiral Flow, at 175°C and 1000 psi
Ash
Storage Temperature, Recommended
Hardness, Shore D, Cull hot
Flexural Strength
Flexural Strength
Flexural Modulus
Flexural Modulus
Volume Resistivity
Dielectric Constant
Dielectric Strength
Dissipation Factor
CTE, linear, Alpha 1
CTE, linear, Alpha 2
Thermal Conductivity
Glass Transition Temp, Tg
Flammability, UL94
Mold Temperature
Back Pressure
Cure Time, In mold
Cure Time, Post mold
Gel Time, Ram follower, at 175°C and 1000 psi
Shelf Life, at 35°C, <40% loss of spiral flow
Shelf Life, at 22°C, <40% loss of spiral flow
Shelf Life, at 5°C, <40% loss of spiral flow

Property Data

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Manufacturer Notes:
none

Category Notes
Plastic

**
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