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Chemically Resistant adhesives
Rogers Corporation TMM® TMM6 Ceramic Thermoset Polymer Composite
Categories: Polymer; Thermoset

Material Notes: TMM® Thermoset microwave materials are ceramic thermoset polymer composites designed for high plate-thru-hole reliability stripline and microstrip applications. The electrical and mechanical properties of TMM laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates, without requiring the specialized production techniques common to these materials.

Features:

  • Wide range of dielectric constants. Ideal for single material systems on a wide variety of applications.
  • Excellent mechanical properties. Resists creep and cold flow.
  • Exceptionally low thermal coefficient of dielectric constant.
  • Coefficient of thermal expansion matched to copper. High reliability of plated through holes.
  • Resistant to process chemicals. No damage to material during fabrication and assembly processes.
  • Thermoset resin for reliable wirebonding. No specialized production techniques required. TMM 10 and 10i laminates can replace alumina substrates.
  • Lead-free process compatible

Typical Applications:

  • RF and Microwave Circuitry
  • Global Positioning Systems Antennas
  • Power Amplifiers and Combiners
  • Patch Antennas
  • Filters and Coupler
  • Dielectric Polarizers and Lenses
  • Satellite Communication Systems
  • Chip Testers

Information provided by Rogers Corporation.

Vendors:
Available Properties
  • Specific Gravity, ASTM D792
  • Water Absorption, ASTM D570, D/48/50
  • Water Absorption, ASTM D570, D/48/50
  • Thickness, Range of Standard Thicknesses
  • Flexural Strength, ASTM D790, X, Y direction; Condition A
  • Flexural Modulus, ASTM D790, X, Y direction; Condition A
  • Izod Impact, Notched, ASTM D256A, X, Y direction
  • Peel Strength, IPC-TM-650 2.4.8, X, Y direction; after solder float 1 oz. EDC
  • Volume Resistivity, ASTM D257
  • Surface Resistance, ASTM D257
  • Insulation Resistance, ASTM D257, C/96/60/95
  • Dielectric Constant, IPC-TM-650 2.5.5.5, Z direction
  • Dissipation Factor, IPC-TM-650 2.5.5.5, Z direction
  • CTE, linear, ASTM D3386, X-, Y-Direction
  • CTE, linear, ASTM D3386, Z-Direction
  • Specific Heat Capacity, calculated
  • Thermal Conductivity, ASTM C518
  • Decomposition Temperature, ASTM D3850, TGA
  
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Category Notes
Plastic

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Chemically Resistant adhesives
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