Cookson Group STAYCHIP® 2078E No-Flow Fluxing Underfill

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Cookson Group STAYCHIP® 2078E No-Flow Fluxing Underfill (discontinued **)
Categories:	Polymer; Adhesive; Thermoset
Material Notes:	STAYCHIP 2078E no-flow underfill is used to perform the dual functions of a solder flux and an underfill between (1) a flip chip die and a substrate or (2) an area array device and a printed circuit board. This material functions as a flux as it solders Sn63/Pb37 bumped pads to common pad metallizations (eutectic Sn/Pb, Cu/Ni/Ag, and OSP coated Cu), using a conventional reflow profile. The product also functions as an underfill as it cures during the conventional reflow profile, immediately after soldering, forming a stress absorbing, compliant matrix that distributes the stress imposed by the CTE mismatch between the die and substrate. This matrix provides enhanced environmental protection and shock resistance. Features: Uses conventional reflow profile to fully cure, with no post-reflow cure needed Little or no voiding when the appropriate STAYCHIP no-flow underfill product is matched to the desired reflow profile Excellent wetting Cure kinetics matched to common Sn63 reflow profiles for high yield process Very low ionic content Exceptional thermal shock/impact resistance Information provided by Cookson Electronics
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Available Properties
Specific Gravity Moisture Absorption at Equilibrium, ASTM D 570-98, 2 hour boil Viscosity Storage Temperature Hardness, Shore D, ASTM D 2240 Dielectric Constant Dielectric Constant Dielectric Constant Dielectric Constant Dissipation Factor Dissipation Factor Dissipation Factor CTE, linear, Alpha 1 CTE, linear, Alpha 2 Glass Transition Temp, Tg, ASTM D3418-82 Pot Life Shelf Life

Property Data

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Manufacturer Notes:
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Category Notes
Plastic

**
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