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Dow SiLK™ I 260 Semiconductor Dielectric Resin  (discontinued **)
Categories: Polymer

Material Notes: SiLK™ I 260 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 260 is compatible with standard IC processing tools in todays fabrications. SiLK™ I 260 is fluorine-free, thus is compatible with Ti and Ta barrier materials.

Information provided by Dow

Dow and DuPont have completed their merger but further transactions/spinoffs are planned.

Vendors:
Available Properties
  • Moisture Absorption, 80% R.H.
  • Thickness, 3000 rpm
  • Thickness, 2000-4000 rpm
  • Tensile Strength, Ultimate
  • Tensile Strength, Yield
  • Tensile Modulus
  • Dielectric Constant
  • Dielectric Strength
  • CTE, linear
  • Thermal Conductivity
  • Thermal Conductivity
  • Glass Transition Temp, Tg
  • Decomposition Temperature, 1% weight loss per hour
  • Refractive Index
  
Property Data

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Manufacturer Notes:
Dow Chemical

Category Notes
Plastic

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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