| Product Description: EPO-TEK® 920-FL is a two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It is a low viscosity version of EPO-TEK® 920. Advantages & Application Notes: - It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal potting compound.
- Rheology allows for a smooth free flowing paste, which allows ease of use for potting and casting applications, as well as syringe dispensing.
- Built-in color change from tan to an amber color. Suggested Applications:
- Hybrids: thermal potting compound; potting connectors and potting transformers, mounting heat sinks to SMDs and ceramic circuits; potting, glob top protection over SMDs.
- PCB Level: heat sinking adhesive; adhesion to Au, Cu, Al, FR4, many plastics, components and connectors.
- Semiconductor: thermal management as semiconductor underfill or glob top encapsulant; potting IC packages like BGAs or CSPs.
- Available in many intermediate viscosity ranges.
- Low temperature curing < 120°C.
Information Provided by Epoxy Technology |
