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Ensinger PEI
Cookson Group STAYSTIK® 282G Aluminum Nitride Filled Thermally Enhanced Paste  (discontinued **)
Categories: Polymer; Adhesive; Thermoplastic

Material Notes: These thermoplastic adhesive pastes are designed for use in a variety of electronic applications. These materials are characterized by their excellent bonding. These pastes can be used for die, lid seal and/or substrate attach in hybrid, Multi-Chip Modules (MCMs) or other microelectronic packages. The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives.

Features:

  • Fully polymerized resin
  • No chemical reaction
  • Easily reworkable
  • No outgassing
  • Bonds in seconds
  • Meets Mil-Std requirements
  • Low modulus material

Information provided by Cookson Electronics

Vendors:
Available Properties
  • Modulus of Elasticity
  • Adhesive Bond Strength, Die shear adhesion, at 25°C
  • Volume Resistivity
  • Thermal Conductivity
  • Maximum Service Temperature, Air, Continuous use
  • Maximum Service Temperature, Air, Excursion Temperature
  • Minimum Service Temperature, Air, Continuous use
  • Glass Transition Temp, Tg
  • Shelf Life, at 25°C
  
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Manufacturer Notes:
none

Category Notes
Plastic

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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Chemically Resistant adhesives
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