Rogers Corporation TMM® TMM4 Ceramic Thermoset Polymer Composite

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Rogers Corporation TMM® TMM4 Ceramic Thermoset Polymer Composite
Categories:	Polymer; Thermoset
Material Notes:	TMM® Thermoset microwave materials are ceramic thermoset polymer composites designed for high plate-thru-hole reliability stripline and microstrip applications. The electrical and mechanical properties of TMM laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates, without requiring the specialized production techniques common to these materials. Features: Wide range of dielectric constants. Ideal for single material systems on a wide variety of applications. Excellent mechanical properties. Resists creep and cold flow. Exceptionally low thermal coefficient of dielectric constant. Coefficient of thermal expansion matched to copper. High reliability of plated through holes. Resistant to process chemicals. No damage to material during fabrication and assembly processes. Thermoset resin for reliable wirebonding. No specialized production techniques required. TMM 10 and 10i laminates can replace alumina substrates. Lead-free process compatible Typical Applications: RF and Microwave Circuitry Global Positioning Systems Antennas Power Amplifiers and Combiners Patch Antennas Filters and Coupler Dielectric Polarizers and Lenses Satellite Communication Systems Chip Testers Information provided by Rogers Corporation.
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Available Properties

Specific Gravity, ASTM D792
Water Absorption, ASTM D570, D/48/50
Water Absorption, ASTM D570, D/48/50
Thickness, Range of Standard Thicknesses
Flexural Strength, ASTM D790, X, Y direction; Condition A
Flexural Modulus, ASTM D790, X, Y direction; Condition A
Izod Impact, Notched, ASTM D256A, X, Y direction
Peel Strength, IPC-TM-650 2.4.8, X, Y direction; after solder float 1 oz. EDC
Volume Resistivity, ASTM D257
Surface Resistance, ASTM D257
Insulation Resistance, ASTM D257, C/96/60/95
Dielectric Constant, IPC-TM-650 2.5.5.5, Z direction
Dissipation Factor, IPC-TM-650, 2.5.5.5, Z direction
CTE, linear, ASTM D3386, X-, Y-Direction
CTE, linear, ASTM D3386, Z-Direction
Specific Heat Capacity, calculated
Thermal Conductivity, ASTM C518
Decomposition Temperature, ASTM D3850, TGA

Property Data

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Manufacturer Notes:
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Category Notes
Plastic

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