Cookson Group POLYSOLDER® LT One Part Electrically Conductive Adhesive Paste

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Cookson Group POLYSOLDER® LT One Part Electrically Conductive Adhesive Paste (discontinued **)
Categories:	Polymer; Adhesive; Thermoset
Material Notes:	This material is a lead-free, no clean, environmentally acceptable solder substitute specifically designed for electronic component assembly, especially surface mount. This product is can be screen printed, stenciled or pneumatically dispensed as a thixotropic paste. The material is hardened by thermal processing in IR, convection, conduction or vapor phase equipment. This patented product is a unique electronics polymer material that forms stable electrical and mechanical junctions with standard components, even after extended environmental aging. Features: Pb-Free Intrinsically Clean Fine Pitch Low Stress Stable Junctions Removable Information provided by Cookson Electronics
Vendors:

Available Properties
Filler Content Viscosity, HBT 5x cp-51 spindle, 1 rpm Adhesive Bond Strength, Die shear Volume Resistivity CTE, linear, Below Tg Thermal Conductivity Glass Transition Temp, Tg Pot Life, On screen Shelf Life

Property Data

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Manufacturer Notes:
none

Category Notes
Plastic

**
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