Park Aerospace Nelco® N4000-13 EP™ BC® Buried Capacitance™, High-Speed Multifunctional Epoxy Laminate and Prepreg

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Park Aerospace Nelco® N4000-13 EP™ BC® Buried Capacitance™, High-Speed Multifunctional Epoxy Laminate and Prepreg
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Nelco N4000-13 EP™ is an enhanced epoxy resin system engineered for today’s leadfree requirements where multiple solder reflow at temperatures approaching 260ºC are required. N4000-13 EP provides enhanced thermal reliability without compromising the electrical and signal loss properties that have made the Nelco N4000-13 product family the industry standard for demanding high speed / low loss designs. The Nelco N4000-13 BC® is offered as a buried capacitance solution, offering a greater degree of design freedom for smaller, more reliable assemblies. Key Features and Benefits: Reliability through multiple lead-free excursions Tg >210°C, outstanding thermal, electrical and signal loss properties CAF Resistant Buried Capacitance Solution Proprietary advanced resin technology High-Tg FR-4 processing Available in a variety of constructions Applications/Qualifications: High Density Interconnects Fine-Line Multilayers Backplanes Surface-Mount Multilayers BGA Multilayers MCM-Ls CSP Attachment Wireless Communications Infrastructure High Speed Services High Speed Storage Networks Internet Switching / Routing Systems Information provided by Park Electrochemical Corp.
Key Words:	EP
Vendors:

Available Properties

Density, 50% Resin Content; Internal Method
Water Absorption, IPC-TM-650.2.6.2.1
Peel Strength, IPC-TM-650.2.4.8, after solder float
Peel Strength, IPC-TM-650.2.4.8.2a, at elevated temperature
Peel Strength, IPC-TM-650.2.4.8, after exposure to process solutions
Dielectric Constant, IPC-TM-650.2.5.5.5, Stripline
Dielectric Constant, IPC-TM-650.2.5.5.9, RF Impedance
Dielectric Constant, Split Post Cavity
Dielectric Strength, IPC-TM-650.2.5.6.2
Dissipation Factor, Split Post Cavity
Dissipation Factor, IPC-TM-650.2.5.5.5, Stripline
Specific Heat Capacity, ASTM E1461
Thermal Conductivity, ASTM E1461
Glass Transition Temp, Tg, IPC-TM-650.2.4.24c, TMA
Glass Transition Temp, Tg, IPC-TM-650.2.4.25c, DSC
Glass Transition Temp, Tg, IPC-TM-650.2.4.24.3, DMA (Tan d Peak)
Decomposition Temperature, IPC-TM-650.2.4.24.6, 5% weight loss; TGA
Flammability, UL94

Property Data

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Manufacturer Notes:
Park Aerospace, former Park Electrochemical Corp.

Category Notes
Plastic

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