CRP Technology Windform® P2 Glass Fiber Reinforced Polyamide for HSS 3D Printing

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CRP Technology Windform® P2 Glass Fiber Reinforced Polyamide for HSS 3D Printing
Categories:	Polymer; 3D Printing/Additive Manufacturing Polymer; Thermoplastic; Nylon (Polyamide PA)
Material Notes:	Windform® P2 is the second polymer from P-LINE. Compared to Windform® P1, which is the first material from P-LINE family, Windform® P2 is distinguished by increased stiffness (Tensile Modulus is 2925 MPa), combined to high tensile strength (39.24 MPa). As Windform® P2 is glass fiber filled, it is an insulating material (CTI rating of 600). Applications include: Components with detailed resolution Small functional prototypes, end-use parts requiring high stiffness across a variety of sectors as electrical consumer and household goods, industrial products, automotive Information provided by CRP Technology.
Key Words:	High Speed Sintering (HSS)
Vendors:

Available Properties

Density
Hardness, Shore D, UNI EN ISO 868
Tensile Strength at Break, UNI EN ISO 527-1, Z Axis
Tensile Strength at Break, UNI EN ISO 527-1, Y Axis
Tensile Strength at Break, UNI EN ISO 527-1, X Axis
Elongation at Break, UNI EN ISO 527-1, Z Axis
Elongation at Break, UNI EN ISO 527-1, X Axis
Elongation at Break, UNI EN ISO 527-1, Y Axis
Tensile Modulus, UNI EN ISO 527-1, Y Axis
Tensile Modulus, UNI EN ISO 527-1, Z Axis
Tensile Modulus, UNI EN ISO 527-1, X Axis
Flexural Strength, UNI EN ISO 14125
Flexural Modulus, UNI EN ISO 14125
Charpy Impact Unnotched, UNI EN ISO 179-1
Charpy Impact Unnotched, UNI EN ISO 179-1
Charpy Impact, Notched, UNI EN ISO 179-1
Charpy Impact, Notched, UNI EN ISO 179-1
Volume Resistivity, ASTM D257-14
Surface Resistance, ASTM D257-14
Comparative Tracking Index, IEC 60112 Solution A
Melting Point, ISO 11357
Deflection Temperature at 1.8 MPa (264 psi), ISO 75 Method A
Vicat Softening Point, ISO 306 Method A50, 10 N

Property Data

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Manufacturer Notes:
none

Category Notes
Plastic
PA, Polyamide

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