A low gel 27.5% vinyl acetate copolymer designed for film and compounding applications. The resin provides very low modulus films with high tensile strength and impact strength.
Applications: Low modulus films; Elastic films; Compounding; Batch inclusion bags; Radio frequency weldable films. Data for film properties below based on 1.25 mil film.
This page displays only the textof a material data sheet.To see MatWeb's complete datasheet for this material (includingmaterial property data, metalcompositions, material suppliers,etc), please click the button below.
Category NotesPlastic