Features: exhibits low shrinkage and stress on components as it cures. composed of an addition-curing polydimethyl siloxane polymer that will not depolymerize when heated in confined spaces. maintains low viscosity for ease of component encapsulation compared to other highly thermally conductive materials. provides excellent thermal shock resistance. provides excellent flame retardancy; UL 94 V-0 certified. ingredients contained in CoolTherm SC-104 encapsulant are permitted for food contact under FDA food additive regulations (21CFR175.300) when material is properly proportioned, mixed, applied and cured.
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Category NotesPlastic