| LORD Thermoset ME-588 encapsulant is an anhydride-free, semiconductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip chip devices. It is formulated with the necessary structural strength to handle over-molding processes. Thermoset ME-588 encapsulant can be fast cured and is engineered to withstand 260°C peak reflow temperatures of lead-free solders. Features: provides low viscosity for high speed jetting dispense. provides surface tension and viscosity flow properties to achieve full coverage without producing bulky fillet on top of device. minimizes the possibility of cracking during temperature cycling (-40 to +150°C); provides excellent thermal shock performance. formulated to flow consistently without voids while maintaining a fast flow rate; can be used under small or large die with high-density interconnects and under devices with stand-off heights below 25 micron. provides good adhesion to laminate, ceramic, solder mask and metal surfaces. provides high Tg and high fracture toughness, reducing the amount of thermally induced stress placed on the solder interconnects. All information provided by Lord. |
