| Description: CORFIL® 615 potting compound is a low density compound for use as insert or edge filling material in honeycomb sandwich construction. After the curing agent is added, CORFIL 615 remains a thick paste which will not run of its own weight when placed in the desired construction. This thixotropic property is highly convenient because it eliminates the need for molds or other containing devices during the curing period. After CORFIL 615 is cured it will withstand subsequent temperatures up to 350°F (177°C) without becoming fluid or otherwise impairing its use as a structural material. Three curing agents are available to cure the potting compound to a hard, rigid material. These are: Curing Agent “Z” for curing at elevated temperature; Curing Agent “A” for curing at 120°F (49°C); and Curing Agent “DTA” for curing at ambient temperature Note 1: Curing agent “A” 6 pha, with cure cycle 2 hours at room temperature plus 16 hours at 120°F (49°C) Note 2: Curing agent “Z” 14.5 pha, with cure cycle 16 hours at 120°F (49°C) plus 1 hour at 300°F (149°C) Note 3: Curing agent “DTA” 7 pha, with cure cycle 24 hours at room temp. Information provided by Cytec, subsequently acquired by Solvay. |
