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DIAB Divinycell® HP 80 Sandwich Core Material
Categories: Other Engineering Material; Composite Core Material; Polymer

Material Notes: Divinycell HP has been developed to be fully compatible with low and medium temperature prepreg and RFI systems. Divinycell HP's elevated temperature performance also extends to its 'in service' life as it will retain a high percentage of its mechanical properties despite exposure to high ambient temperatures.

The mechanical properties of Divinycell HP have not been compromised in order to achieve its elevated temperature performance. It offers higher values than other commonly used 'elevated temperature cores' in all significant areas including its strength properties, elongation to break, ductility, adhesion/peel strength, fracture toughness and dimensional stability. Other key features of Divinycell HP include excellent chemical resistance (including styrene), low water absorption and good thermal/acoustic insulation.

Continuous operating temperature is -200 to 80°C. The foam can be used in sandwich structures, for outdoor exposure, with external skin temperatures up to 100°C. Normally Divinycell HP can be processed up to 145°C with minor dimensional changes. Maximum processing temperature is dependent on time, pressure and process conditions.

Information Provided by DIAB

Vendors:
Available Properties
  • Density, ISO 845
  • Tensile Strength, Ultimate, ASTM D1623, Perpendicular to the plane
  • Elongation at Break, ASTM C273, In Shear
  • Tensile Modulus, ASTM D1623, Perpendicular to the plane
  • Compressive Strength, ASTM D1621, Perpendicular to the plane
  • Compressive Modulus, ASTM D1621, Perpendicular to the plane
  • Shear Modulus, ASTM C273
  • Shear Strength, ASTM C273
  • CTE, linear
  • Maximum Service Temperature, Air, Continuous
  • Minimum Service Temperature, Air, Continuous
  
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Manufacturer Notes:
DIAB Inc.

Category Notes
Plastic

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