MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
  
Master Bond adhesives
Cookson Group STAYCHIP® 3103 Low Stress Underfill with Enhanced JEDEC Performance  (discontinued **)
Categories: Polymer; Adhesive; Thermoset

Material Notes: STAYCHIP™ 3103 is specially formulated to minimize warpage and thermal stress within the die and at the underfill-die interface, which otherwise could initiate defects such as die cracking, fillet cracking and delamination. The low CTE and high strength & toughness of STAYCHIP™ 3103 provide excellent solder-joint protection during thermal cycling, while its superior adhesion to common solder-mask and die passivation surfaces (even after exposure to elevated heat, pressure, and humidity), ensure exceptional JEDEC performance. The fast flow characteristics are designed for penetration of gaps below 1mil.

Features:

  • Low Stress & Warpage
  • Passes JEDEC L3/ 3 x 260°C on 10X10mm Polyimide passivated die
  • Low CTE for Excellent Reliability in Thermal Cycling
  • Exceptional Adhesion (even after exposure to high humidity, pressure, and temperature)
  • Fast, Efficient Flow Properties
  • Small particle size filler for use on fine pitch array packages

Information provided by Cookson Electronics

Vendors:
Available Properties
  • Specific Gravity, ASTM D 792-00
  • Filler Content
  • Moisture Absorption at Equilibrium, ASTM D5229/D 5229M-92 (1998) e1. D 570-98, 24 hour boil
  • Particle Size
  • Brookfield Viscosity, ASTM D2196-99, Brookfield #51 at 10 RPM
  • Storage Temperature
  • Hardness, Shore D, ASTM D 2240-03
  • Fracture Toughness, ASTM D5045-99
  • Adhesive Bond Strength, DIN EN 60749-20, Shear strength to Si3N2 passivated die, 75 micron gap, at 200°C
  • Adhesive Bond Strength, DIN EN 60749-19, Shear strength to Si3N2 passivated die, 75 micron gap, at 25°C
  • Dielectric Constant
  • Dissipation Factor
  • Dissipation Factor
  • Dissipation Factor
  • CTE, linear, Alpha 1
  • CTE, linear, Alpha 2
  • Glass Transition Temp, Tg, ASTM D3418-99, By DSC
  • Flash Point, ASTM D 93-02
  • Pot Life, ISO 10364:1993, Time to double viscosity
  • Shelf Life
  
Property Data

This page displays only the text
of a material data sheet.

To see MatWeb's complete data
sheet for this material (including
material property data, metal
compositions, material suppliers,
etc
), please click the button below.

Manufacturer Notes:
none

Category Notes
Plastic

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

Users of our Advanced Search (registration required) may exclude discontinued materials from search results.

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

 

Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at webmaster@matweb.com. We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2024 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.