| Description: THERM-A-GAP™ elastomers are used to fill air gaps between PC boards or other components and heat sinks, metal enclosures, and chassis. The exceptional conformability of these advanced materials enables them to blanket highly uneven surfaces, transferring heat away from individual components or entire boards, and allowing chassis parts to be used as heat spreaders where space is restricted. The 574 thermal interface pads provide superior thermal performance and are softer than other THERM-A-GAP™ materials. G574 material consists of an extremely soft silicone elastomer loaded with ceramic particles, coated onto a fiberglass cattier. The “G” designates the fiberglass cattier that is on one side of the material. This reinforces the pad and makes one side of the pad non-tacky. The non-tacky side can be easily removed for component repairs. The flexible, elastic nature allows the material to blanket highly uneven surfaces, drawing away and transferring heat from components such as microprocessors, video chips, and power devices. These fiberglass-reinforced pads consist of an electrically non-conductive ceramic filled silicone elastomer with a thermal conductivity of 1.6 W/m-K. These pads are best suited for applications where a gap of approximately .040 to 0.200 inch needs to be filled under pressures of 5 to 20 psi. Application: G574 is inherently self-adhering on the side opposite from the fiberglass carrier for ease of pad application. Remove the liner and place pad on the desire heat pipe or a microprocessor heat sink. The pads can be removed from the fiberglass side (non-tacky side) for rework. Information provided by Chomerics |
