| Replaced by UV15-7DCNV Key Features: - Dual cure: heat & UV light
- Allows curing in “shadowed out” areas
- Can be used for potting up to 1/8 inch thick
- Low shrinkage
Product Description Master: Bond UV15-7DC is a one component, dual cure UV system for high performance bonding, sealing, coating and encapsulation applications. This system features a primary cure utilizing UV light and a secondary cure that requires heating for curing “shadowed out” sections that are not exposed to UV light. The heat required for polymerization is 250-300°F for 15-30 minutes. The UV part of the curing system is most often used for fixturing with the heat curing cycle being added to complete the cure. UV15-7DC has superior physical strength properties, low shrinkage upon cure and good non-yellowing stability. It bonds well to a wide variety of substrates, including glass, metals and many high temperature plastics. This system has very good resistance to chemicals such as water, acids, bases and fuels. UV15-7DC offers excellent dimensional stability, superb electrical insulation properties and a very good capacity to withstand thermal cycling. It has a service temperature range of -80°F to +300°F. UV15-7DC is 100% reactive and does not contain any solvents or other volatiles. The UV part of the cure is not oxygen inhibited and cures readily in 10-30 seconds when exposed to a UV light source emitting at a wavelength of 320-365 nm with an energy output as low as 20-40 milliwatts/cm². The rate of cure depends upon the compound’s distance from the light source, the thickness of the section and, of course, the intensity of the light source. As far as the heat curing mechanism, the elevated temperature must reach a minimum of 250°F, as mentioned above. Also, UV15-7DC can even be used for encapsulations up to 1/8 inch thick. However, when used in this manner, the heating should be ramped up slowly (over the course of 30-40 minutes). This system is widely used in optical, fiberoptic, electronic, laser, microelectronic and semiconductor applications. Product Advantages: - One component system; no mixing required
- Possesses a dual curing mechanism of UV light and heat
- System capable of rapid fixturing with UV light and curing in “shadowed out” areas by heat
- Bonds well to a wide variety of substrates
- Excellent physical strength and electrical insulation properties
- Can be used for potting up to 1/8 inch thick
Information provided by Master Bond Inc. |
