Widely used in the electronics industry for substrates and heat sinks, where it offers significant advantages over metals, polymeric materials, and many ceramics. Prime Features: - Excellent thermal conductivity
- Low coefficient of thermal expansion
- Good electrical insulator
- Good dielectric properties
- Accepts bonding with copper foil for high current duties
- Impervious to plating chemicals
- Non-toxic
Typical Applications:- Heat sink modules for high powered laser diodes and similar components
- High power rectifiers
- Microwave substrates
- High power hybrids
Production Capabilities: - Advanced powder forming, CNC grinding and laser machining
- Precision machining to close tolerances
- High strength bonding with copper foil by high temperature brazing in vacuum
- Prototype, batch and volume production
Information provided by Morgan Advanced Materials |