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Master Bond adhesives
Lord Adhesives Thermosetâ„¢ ES-100 Epoxy Encapsulant
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: LORD Thermoset ES-100 epoxy encapsulant is a two-component epoxy system designed specifically for encapsulation of intricate electrical and electronic components used in automotive, marine and heavy industrial applications. Thermoset ES-100 encapsulant maintains its flexibility and low modulus characteristics after thermal aging, making it an excellent choice for potting or encapsulating delicate and pressure-sensitive electronic components.

Features: maintains low viscosity for ease of void-free component encapsulation. exhibits low shrinkage and stress on components as it cures. provides excellent resistance to marine engine compartment fluids and automotive under-the-hood fluids. provides excellent resistance to moisture and humidity; exhibits good hydrolytic stability; maintains flexibility in extremely harsh environments and temperatures.

All information provided by Lord.

Vendors:
Available Properties
  • Specific Gravity, ES-100 Hardener
  • Specific Gravity, Mixed
  • Specific Gravity, ES-100 Resin
  • Water Absorption, cured
  • Viscosity, ES-100 Resin
  • Viscosity, Mixed
  • Viscosity, ES-100 Hardener
  • Hardness, Shore OO, ASTM D 2240
  • Tensile Strength, ASTM D 412, cured
  • Elongation at Break, ASTM D 412, cured
  • Volume Resistivity, ASTM D 257, cured
  • Dielectric Constant, ASTM D 150, cured
  • Dielectric Strength, cured
  • Dissipation Factor, ASTM D 150, cured
  • CTE, linear, ASTM D 696, cured
  • Glass Transition Temp, Tg, cured, by TMA
  • Working Life, Mixed
  • Gel Time, mixed, cured
  • Shelf Life, each component from date of manufacture
  
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Manufacturer Notes:
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Category Notes
Plastic

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