| TRA-BOND 2222 is a solvent-free, one-part thixotropic, epoxy adhesive recommended for SMD (Surface Mount Device) bonding and sealing applications where its easy handling, high strength and superior electrical insulation features are required. This smooth paste adhesive can be dispensed pneumatically, or by screen or pin transfer without stringing or tailing, and can position components before cure. TRA-BOND 2222 has a six month shelf life and develops strong, durable, solvent-resistant bonds - after a required high temperature cure cycle - to and between many different materials such as semiconductors, ceramics, glass, metals, and laminates. It is ideal for bonding chip-on-board, active and/or passive chip-type components in the fabrication of printed, integrated and hybrid circuits, and is just right for screen printing and epoxy die mounting applications, or for the assembly and repair of printed circuits, wave guides and electrical modules. Information provided by Tra-Con Inc. |
