| Lord TC-228 is a non-reactive, non-silicone, thermally conductive grease with a non-flowable consistency. It is rated for use in applications where the continuous operating temperature is < 200°C and can withstand intermittent exposure up to 300°C. TC-228 is designed for use in applications where a silicon-free thermal interface material is required and where the device may later need to be easily removed from the heat sink. It can be used with a variety of emerging and standard devices including microprocessors, DSPs, graphic accelerators, etc. packaged in flip-chip, PPGA, BGA. MicroBGA and other package types. TC-228 exhibits low bleed and has a successful history of use in demanding environments, including microprocessor flip-chip applications.All information provided by Lord. |
