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Master Bond adhesives
Oxygen-free extra-low phosphorus Copper, UNS C10300, H02 temper, flat product
Categories: Metal; Nonferrous Metal; Copper Alloy; Wrought Copper

Material Notes: Flat test specimen, 1 mm thick.

Applications: electrical conductors and terminals, tubular busbars, commutators, copper clad steel and clad products, waveguide tubing, thermostatic control tubing, and applications requiring good conductivity and welding or brazing properties.

Processing: Excellent hot and cold workability; good forgeability. Annealing temp.: 475-750°C (900-1400°F). Hot working temp.: 750-875°C (1400-1600°F). Fabricated by coining, coppersmithing, drawing and upsetting, hot forging and pressing, spinning, swaging, stamping.

Corrosion Resistance: Good to excellent

Weldability: excellent welding and brazing properties.

UNS C10300, CDA 103, ASTM B133, B152, B187, B272, B432

Key Words: OFXLP, CDA 103, ASTM B133, 152, 187, 272, 432
Vendors:
Available Properties
  • Density
  • Hardness, Rockwell B
  • Hardness, Rockwell F
  • Hardness, Rockwell 30T
  • Tensile Strength, Ultimate
  • Tensile Strength, Yield
  • Elongation at Break, in 50 mm (2 in.)
  • Modulus of Elasticity
  • Poissons Ratio
  • Fatigue Strength, strip
  • Machinability, UNS C36000 (free-cutting brass) = 100%
  • Forgeability
  • Shear Modulus
  • Shear Strength
  • Electrical Resistivity, 99% IACS
  • CTE, linear
  • CTE, linear
  • CTE, linear
  • Specific Heat Capacity
  • Thermal Conductivity
  • Melting Point
  • Solidus
  • Liquidus
  • Annealing Point
  • Copper, Cu, Includes Cu+Ag+P
  • Other
  • Phosphorus, P
  
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