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Arlon 84N Polyimide Laminate and Prepreg
Categories: Polymer; Thermoset; Polyimide, TS

Material Notes: 84N is a high performance ceramic-filled polyimide prepreg based on Arlon's 85N pure polyimide system, designed for use in filling etched areas in polyimide multilayers that contain thick copper layers and for filling clearance holes in metal cores. The ceramic filler in the resin serves to reduce shrinkage and inhibit crack formation during through-hole drilling in filled clearance areas.

  • High Tg polyimide (>250°C) with Thermal Decomposition temperature (Td) >400°C and T300>60 minutes
  • Low z-expansion of 1% between 50-250°C offers superior PTH reliability through manufacture, assembly and in service
  • Up to 50% or more reduction in cure time compared with traditional polyimide cycles
  • Electrical and mechanical properties meeting the requirements of IPC-4101/40 and /41
  • Toughened, Non-MDA chemistry resists drill cracking
  • Halogen-free chemistry
  • Compatible with lead-free solder processing
  • RoHS/WEEE compliant

Typical Applications:

  • MLB's that are designed with clearance holes in metal cores or for thick metal powder and ground planes that require the thermal stability of polyimide
  • Applications requiring significant lifetimes at elevated temperatures, such as aircraft engine instrumentation, down hole drilling, under-hood automotive applications, industrial sensor systems and burn-in testing of IC's.

    This data represents typical values for the production material and should not be used as material specifications.

    Information provided by ARLON Silicone Technologies Division.

  • Vendors:
    Available Properties
    • Density, ASTM D792 Method A
    • Water Absorption, IPC TM-650 2.6.2.1
    • Modulus of Elasticity, IPC TM-650 2.4.18.3
    • Poissons Ratio, ASTM D3039
    • Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Process Solutions
    • Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Thermal Stress
    • Peel Strength, IPC TM-650 2.4.8.2, To Copper (1 oz./35 micron); At Elevated Temperatures
    • Volume Resistivity, IPC TM-650 2.5.17.1, C96/35/90
    • Volume Resistivity, IPC TM-650 2.5.17.1, E24/125
    • Surface Resistance, IPC TM-650 2.5.17.1, C96/35/90
    • Surface Resistance, IPC TM-650 2.5.17.1, E24/125
    • Dielectric Constant, IPC TM-650 2.5.5.3, may vary with resin %
    • Dielectric Strength, IPC TM-650 2.5.6.2
    • Dissipation Factor, IPC TM-650 2.5.5.3
    • Arc Resistance, IPC TM-650 2.5.1
    • CTE, linear
    • CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z, below Tg
    • CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z, above Tg
    • Thermal Conductivity, ASTM E1461
    • Glass Transition Temp, Tg, IPC TM-650 2.4.24, TMA
    • Decomposition Temperature, IPC TM-650 2.3.41, Initial
    • Decomposition Temperature, IPC TM-650 2.3.41, 5 percent
    • Flammability, UL94
      
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