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Morgan Advanced Ceramics Vacupor® MS-LD Thermal Ceramic
Categories: Ceramic; Oxide

Material Notes: Fused Silica. VACUPOR® MS-LD is a microporous insulation material with an extremely low coefficient of thermal conductivity, i.e. with very good insulating properties. VACUPOR® MS-LD consists basically of inorganic oxides. The main constituent is fumed silica, the other components are opacifiers for minimizing infrared radiation, and silicates. The barrier film wrapping of VACUPOR® MS-LD is processed in form of a double middle seam. This results in a particularly good surface quality. Due to the missing side flaps, the panels can almost be form-fit sticked together butt joint. In foaming processes the foam flow is significantly less constrained, and the formation of cavities is significantly reduced. VACUPOR® MS-LD (core material) is not flammable and is classified A1 according to DIN ISO EN 13501-1. VACUPOR® MS-LD is heat sealed in a metallized, multilayer plastic film under vacuum. The very low internal pressure and the microporous panel core is responsible for the extremely low thermal conductivity value. VACUPOR® MS-LD was specifically developed for vacuum insulation applications in the appliance- /refrigeration industry, where demands on the surface characteristics (e.g. side walls) and dimensional stability are not of a high priority.

Applications: VACUPOR® MS-LD is also sucessfully used as insulation material in the following areas:

  • Refrigerators and freezers
  • Cryogenic freezers.
  • Temperature controlled packaging.

Information provided by Morgan Advanced Materials

Key Words: Thermal Ceramics
Vendors:
Available Properties
  • Density
  • Density, 15% compression @ 2 bar
  • Density, 10% compression @ 2 bar
  • Thermal Conductivity, DIN 52612, at 1mbar, according to EMPA test report No. 437840/1 dated December 21, 2006. For sample size 1000x600mm
  • Thermal Conductivity, DIN 52612, at ambient pressure
  • Thermal Conductivity
  • Thermal Conductivity
  • Thermal Conductivity
  • Thermal Conductivity
  • Thermal Conductivity
  • Thermal Conductivity
  
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